DocumentCode :
2035944
Title :
Compressing deformation investigation of single-walled carbon nanotube coated with Ni
Author :
Youkai Chen ; Fulong Zhu ; Hengyou Liao ; Wei Zhang ; Sheng Liu
Author_Institution :
State Key Lab. for Digital Manuf. Equip. & Technol., Huazhong Univ. of Sci. & Technol., Wuhan, China
fYear :
2012
fDate :
5-7 Dec. 2012
Firstpage :
728
Lastpage :
731
Abstract :
Mechanical behaviors of single-walled carbon nanotube (SWCNT) and Ni-coated single-walled carbon nanotube (SWCNT-Ni) were investigated by using molecular dynamics (MD) simulation method. From these results of molecular dynamics simulation for two models of SWCNT and SWCNT-Ni, it was found that the Young´s Modulus of SWCNT was higher than that of SWCNT-Ni, and failure stress and failure strain of SWCNT were also lower than that of SWCNT-Ni at same temperature point of 300K, 500K, and 700K. In order to understand compressing behaviors of different temperature, two different molecular models of SWCNT and SWCNT-Ni were analyzed at 300K, 500K and 700K respectively, and it was revealed that temperature fluctuation could also change the Young´s Modulus, critical stress, and critical strain. In this work, it was very clear that nickel atoms on surface of SWCNT-Ni could retard local buckling at the processing of compressing. Coating nickel atoms on surface of SWCNT could improve some mechanical properties of SWCNT.
Keywords :
Young´s modulus; carbon nanotubes; deformation; molecular dynamics method; nickel; protective coatings; C; Ni-C; Ni-coated single-walled carbon nanotube; SWCNT-Ni; Young´s modulus; buckling; critical strain; critical stress; deformation; failure strain; failure stress; mechanical properties; molecular dynamics simulation; temperature 300 K; temperature 500 K; temperature 700 K; temperature fluctuation; Carbon nanotubes; Fluctuations; Nickel; Strain; Stress; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging Technology Conference (EPTC), 2012 IEEE 14th
Conference_Location :
Singapore
Print_ISBN :
978-1-4673-4553-8
Electronic_ISBN :
978-1-4673-4551-4
Type :
conf
DOI :
10.1109/EPTC.2012.6507178
Filename :
6507178
Link To Document :
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