DocumentCode :
2036154
Title :
LED thermal management of an automotive electronic control module with display
Author :
Kumar, Sreerama Kumar ; Warn, S.C. ; Lee, Razak
Author_Institution :
Delphi Automotive Syst., Tech. Center India, Bangalore, India
fYear :
2012
fDate :
5-7 Dec. 2012
Firstpage :
764
Lastpage :
769
Abstract :
In automobiles, an ECM (Electronic Control Module) is used for controlling internal ambient temperature of vehicles to enhance comfort level of passengers. It typically contains a display module to show various operational modes such as cooling air temperature, ON/OFF for blower, AC, de-fogger etc. The display module uses LEDs as source of illumination. Adequate illumination requires packaging of several LEDs m a compact/constrained space. Also LEDs must operate at very high ambient temperature of 85°C that leads to significant thermal management challenges. This paper describes parametric studies using various thermal management techniques such as heat spreader, increased PCB copper layer thickness, increased copper pad size for LED, high conductive plastic back cover along with pedestals, thermal via for LEDs and vent holes for the enclosure; to bring down LED temperatures within its safe operating limit. LEDs are modeled in detail (using contact resistance between the die and lead frame) in order to improve the accuracy of junction temperature prediction. A combination of thermal management solutions/techniques are used to mitigate heat from LEDs with significant bearing on cost competitiveness.
Keywords :
LED displays; automotive electronics; printed circuits; thermal management (packaging); ECM; LED thermal management; PCB copper layer thickness; automobiles; automotive electronic control module; compact-constrained space; conductive plastic back cover; copper pad size; display module; heat mitigation; illumination source; junction temperature prediction; passenger comfort level enhancement; pedestals; temperature 85 degC; vehicle internal ambient temperature temperature; vent holes; Conferences; Decision support systems; Electronics packaging;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging Technology Conference (EPTC), 2012 IEEE 14th
Conference_Location :
Singapore
Print_ISBN :
978-1-4673-4553-8
Electronic_ISBN :
978-1-4673-4551-4
Type :
conf
DOI :
10.1109/EPTC.2012.6507187
Filename :
6507187
Link To Document :
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