Automatic chip placement: one solution, user-benefits, and future development

Author

Chalsen, Michael J.

Author_Institution

Micro Robotics Syst. Inc., Chelmsford, MA, USA

fYear

1991

fDate

11-16 May 1991

Firstpage

422

Lastpage

427

Abstract

The author explores generic chip placement challenges and assembly options. A specific commercial solution for automated die bonding in the microelectronics marketplace, namely the MRSI-501 automated die placement system is described. The placement accuracy is ±0.002 to 0.003 in and two degrees in theta. However, the same system places flip chips to within ±0.0015 in. The system´s throughput rate is 400-450 die per hour for vision-guided placements and 900 die per hour for direct pick and place. Developments in chip placement systems, including ultraprecision placement, are discussed

Keywords

flip-chip devices; hybrid integrated circuits; industrial robots; integrated circuit technology; microassembling; MRSI-501; assembly; automated die bonding; automated die placement system; chip placement; five axes cylindrical robot; flip chips; ultraprecision placement; Assembly; Bonding; Electronic equipment manufacture; Electronics packaging; Flip chip; Integrated circuit interconnections; Manufacturing; Military computing; Packaging machines; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1991. Proceedings., 41st

Conference_Location

Atlanta, GA

Print_ISBN

0-7803-0012-2

Type

conf

DOI

10.1109/ECTC.1991.163909

Filename

163909