Characteristics of Cu thin film on PET by ECR-PECVD

Author

Jhin, J. ; Koh, Hyun-woo ; Lee, Jeyull ; Park, DaeLim ; Byun, D.

Author_Institution

Dept. of Mater. Sci. & Eng., Korea Univ., Seoul, South Korea

fYear

2003

fDate

5-5 June 2003

Firstpage

405

Abstract

Summary form only given, as follows. Metallized polymers were prepared at an ambient temperature by an electron-cyclotron-resonance (ECR) plasma enhanced chemical vapor deposition (PECVD) system equipped with (-)DC bias from the Cu(hfac)/sub 2/-Ar-H/sub 2/ system. Metallized polymers, and especially poly ethylene terephthalate (PET), are currently being studied and employed for microelectronic packaging, magnetic tapes, EMI shielding, etc. Copper is an attractive material for metallization thanks to its intrinsic electromigration resistance and low resistivity.

Keywords

copper; electromagnetic shielding; integrated circuit metallisation; integrated circuit packaging; magnetic tapes; plasma CVD; plasma CVD coatings; Cu; ECR-PECVD; EMI shielding; PET; ambient temperature; electron-cyclotron-resonance plasma enhanced chemical vapor deposition; magnetic tapes; metallization; metallized polymers; microelectronic packaging; poly ethylene terephthalate; thin film; Chemical vapor deposition; Copper; Metallization; Plasma applications; Plasma chemistry; Plasma properties; Plasma temperature; Polymer films; Positron emission tomography; Transistors;

fLanguage

English

Publisher

ieee

Conference_Titel

Plasma Science, 2003. ICOPS 2003. IEEE Conference Record - Abstracts. The 30th International Conference on

Conference_Location

Jeju, South Korea

ISSN

0730-9244

Print_ISBN

0-7803-7911-X

Type

conf

DOI

10.1109/PLASMA.2003.1229952

Filename

1229952