• DocumentCode
    2037493
  • Title

    Advances in high C-V multilayer ceramic chip capacitors

  • Author

    Borzych, John ; Harada, Hiraku

  • Author_Institution
    TDK Corp. of America, Mount Prospect, IL, USA
  • fYear
    1991
  • fDate
    11-16 May 1991
  • Firstpage
    442
  • Lastpage
    445
  • Abstract
    It is pointed out that the multilayer ceramic chip capacitor (MCC) has made great strides in the area of package density, described as the capacitance-voltage (C-V) product divided by the case size. This high-density packaging requirement is manifest in telecommunications, computers, and consumer electronics and other battery-powered products. The increased use of battery-powered products and systems has in turn reduced voltage rating requirements, and therefore allows reduced dielectric thicknesses for MCCCs. The voltage rating for these dense multilayer ceramic chip capacitors was selected at 16 V, to allow for a reasonable factor of safety in most battery-powered applications and because of its typical rating for tantalum capacitors. This technology provides a means for packaging a 16-V, 10-μF capacitor in an EIA 1206 (0.120 in×0.060 in) case size
  • Keywords
    capacitors; surface mount technology; 10 muF; 16 V; EIA 1206; MLC capacitors; SMD; SMT; battery-powered applications; high-density packaging requirement; multilayer ceramic chip capacitors; Capacitance-voltage characteristics; Capacitors; Ceramics; Consumer electronics; Dielectrics; Electronics packaging; Nonhomogeneous media; Safety; Telecommunication computing; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 1991. Proceedings., 41st
  • Conference_Location
    Atlanta, GA
  • Print_ISBN
    0-7803-0012-2
  • Type

    conf

  • DOI
    10.1109/ECTC.1991.163913
  • Filename
    163913