Compact multi-channel LED/PD array modules using new assembly techniques for hundred Mb/s/ch parallel optical transmission

Author

Itoh, M. ; Nagahori, T. ; Kohashi, H. ; Haneko, H. ; Honmou, H. ; Watanabe, I. ; Uji, T. ; Fujiwara, M.

Author_Institution

NEC Corp., Kanagawa, Japan

fYear

1991

fDate

11-16 May 1991

Firstpage

475

Lastpage

478

Abstract

Compact 12-channel LED/PD (light emitting diode/photodiode) array modules using novel assembly techniques have been developed for high-speed parallel optical transmission. Optical and electronic devices were mounted on a lateral point and the common submount surfaces, respectively, for high-speed operation and module package miniaturizing. The flip-chip technique by solder bumps was employed for optical array chip bonding, in order to simplify the chip mounting., A 12-channel 150- Mbit/s/ch 100-m parallel optical transmission with small electronic crosstalk has been demonstrated

Keywords

integrated optoelectronics; light emitting diodes; optical links; photodiodes; 100 m; 150 Mbit/s; LED/PD array modules; assembly techniques; chip mounting; flip-chip technique; high-speed operation; module package miniaturizing; multichannel optical links; optical array chip bonding; parallel optical transmission; Assembly; Bonding; Electronics packaging; High speed optical techniques; Light emitting diodes; Optical arrays; Optical crosstalk; Optical devices; Photodiodes; Stimulated emission;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1991. Proceedings., 41st

Conference_Location

Atlanta, GA

Print_ISBN

0-7803-0012-2

Type

conf

DOI

10.1109/ECTC.1991.163918

Filename

163918