Microsystem models in integrated pressure sensor design

The paper describes design of a simple microsystem structure of capacity pressure circuit with integrated inductance on a single Si chip. Model system with corresponding software support is utilized for design. Different models were designed for simulation of the properties of the designed structure. Model of the substitute electronic circuit involves active and parasitic elements. The properties of this equivalent model are explored using the SPICE circuit simulator. Mechanical properties of the structure are explored using the CoventorWare program. Distribution of mechanical stress and boundary parameters are the most important ones. The paper describes flow of design software. Tools used for the design of integrated structure are described as well. Parasitic elements influencing resulting parameters are discussed; equivalent circuit connection of the integrated structure including calculation of theoretical numeric values of these elements is designed. Various modifications of integrated structure are designed and realized. The paper is completed with reached results.