Title : 
An Efficient Equivalent Circuit Model for the EMC Analysis of Power/Ground Noise
         
        
            Author : 
Wei, X.C. ; Li, E.P. ; Liu, E.X.
         
        
            Author_Institution : 
Inst. of High Performance Comput., Nat. Univ. of Singapore, Singapore
         
        
        
        
        
        
            Abstract : 
With the ever decreasing feature size and increasing operating frequency, the noise coupling inside the power-ground planes becomes more and more serious. We propose an efficient integral equation method to simulate such electromagnetic compatibility problem. With the help of the structural features of the power-ground planes, the integral equation is simplified to a two-dimensional equation. This greatly reduces the computing time and still gives a good accuracy. By discretizing the integral equation, the equivalent circuit model is derived for each power-ground pair. It is straightforward to combine the derived circuit model with other circuit models, such as the transmission lines models of the interconnects and the on-board lumped components, to perform the system-level signal integrity and power integrity simulations.
         
        
            Keywords : 
electromagnetic compatibility; equivalent circuits; integrated circuit modelling; electromagnetic compatibility; equivalent circuit model; integral equation method; noise coupling; on-board lumped components; power integrity simulations; power-ground planes; power/ground noise; transmission lines models; Circuit noise; Circuit simulation; Computational modeling; Coupling circuits; Electromagnetic compatibility; Equivalent circuits; Frequency; Integral equations; Power system modeling; Power transmission lines;
         
        
        
        
            Conference_Titel : 
Signal Propagation on Interconnects, 2008. SPI 2008. 12th IEEE Workshop on
         
        
            Conference_Location : 
Avignon
         
        
            Print_ISBN : 
978-1-4244-2317-0
         
        
            Electronic_ISBN : 
978-1-4244-2318-7
         
        
        
            DOI : 
10.1109/SPI.2008.4558350