DocumentCode
2039637
Title
MOCHA, MOdelling and CHAracterization for SiP -Signal and Power Integrity Analysis
Author
Girardi, A. ; Conci, A. ; Izzi, R. ; Lessio, T. ; Canavero, F.G. ; Stievano, I.S. ; Dudek, H. ; Hardisty, D. ; Tarantini, M. ; Dieudonne, M. ; Hese, J. Van ; Cunha, T.R. ; Pedro, J.C. ; Gaquiere, Christopher ; Vellas, N.
Author_Institution
STMicroelectronics (M6) Srl, Agrate Brianza
fYear
2008
fDate
12-15 May 2008
Firstpage
1
Lastpage
2
Abstract
This paper describes the research activity that is being carried out in the MOCHA project, a cooperative R&D effort at the European scale. The aim of the project is to develop reliable modelling and simulation solutions for SiP design verification.
Keywords
integrated circuit design; system-in-package; SiP design verification; power integrity analysis; signal analysis; Analytical models; Electronic design automation and methodology; Electronics packaging; Integrated circuit modeling; Integrated circuit packaging; Performance evaluation; Power supplies; Power system modeling; Signal analysis; Signal design;
fLanguage
English
Publisher
ieee
Conference_Titel
Signal Propagation on Interconnects, 2008. SPI 2008. 12th IEEE Workshop on
Conference_Location
Avignon
Print_ISBN
978-1-4244-2317-0
Electronic_ISBN
978-1-4244-2318-7
Type
conf
DOI
10.1109/SPI.2008.4558357
Filename
4558357
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