Title :
Relative Permittivity Variation Surrounding PCB Via Hole Structures
Author :
Simonovich, Lambert
Author_Institution :
Nortel, Ottawa, ON
Abstract :
As integrated circuit technology advancements are pushing data rates to 6 Gb/s and beyond, channel simulations are becoming a necessity. As part of the topology modeling and simulation, the correct value of permittivity surrounding a printed circuit board (PCB) via hole structure is required for better accuracy. This paper presents data to suggest the relative permittivity of the dielectric surrounding a PCB via hole structure in the z-axis direction of a fiberglass reinforced PCB laminate is different from the relative permittivity surrounding a trace etch in the x/y-axis direction of the same PCB.
Keywords :
fibre reinforced composites; laminates; permittivity; printed circuits; fiberglass reinforced PCB laminate; hole structure; printed circuit board; relative permittivity variation; trace etch; Dielectric materials; Etching; Glass; Integrated circuit technology; Laminates; Permittivity; Predictive models; Resins; Transmission lines; Yarn;
Conference_Titel :
Signal Propagation on Interconnects, 2008. SPI 2008. 12th IEEE Workshop on
Conference_Location :
Avignon
Print_ISBN :
978-1-4244-2317-0
Electronic_ISBN :
978-1-4244-2318-7
DOI :
10.1109/SPI.2008.4558362
