Application of Thin-Film RCLG Model for the Modeling of Inkjet Printed Microstrip Lines

Author

Lilja, Juha ; Makinen, Riku ; Pynttari, Vesa ; Mansikkamaki, Pauliina ; Kivikoski, Markku

Author_Institution

Tampere Univ. of Technol., Tampere

fYear

2008

fDate

12-15 May 2008

Firstpage

1

Lastpage

4

Abstract

Conductor thickness arising from printable electronics manufacturing technology is typically of the order of a skin depth in the frequency range from the upper UHF band to the lower SHF band. Modeling these conductors using standard circuit models however yield inaccurate results whereas full-wave modeling is very time consuming. In this paper, a circuit simulation model based on the surface resistance of a thin penetrable conductor is presented. The proposed model is validated by comparison with full-wave simulation results, Comparison with a conventional circuit-simulation model shows improved accuracy in the loss calculation.

Keywords

ink jet printers; integrated circuit modelling; microstrip lines; surface resistance; SHF band; UHF band; circuit simulation; conductor thickness; inkjet printed microstrip lines; printable electronics manufacturing; surface resistance; thin penetrable conductor; thin-film RCLG model; Circuit simulation; Conducting materials; Conductivity; Conductors; Frequency; Microstrip; Skin; Software packages; Surface resistance; Transistors;

fLanguage

English

Publisher

ieee

Conference_Titel

Signal Propagation on Interconnects, 2008. SPI 2008. 12th IEEE Workshop on

Conference_Location

Avignon

Print_ISBN

978-1-4244-2317-0

Electronic_ISBN

978-1-4244-2318-7

Type

conf

DOI

10.1109/SPI.2008.4558369

Filename

4558369