• DocumentCode
    2040267
  • Title

    Field Emission from Vertically Aligned Silicon Nanowires

  • Author

    She, J.C. ; Yao, R.H. ; Deng, S.Z. ; Chen, Jun ; Xu, N.S.

  • Author_Institution
    State Key Lab. of Optoelectron. Mater. & Technol., Sun Yat-sen Univ., Guangzhou
  • fYear
    2006
  • fDate
    38899
  • Firstpage
    51
  • Lastpage
    52
  • Abstract
    Au-Ag nanoparticles are used as nanomasks for Si nanowires fabrication. Au-Ag alloy film deposited on Si substrate is annealed in H 2 ambient at a temperature of 750degC. The SiNWs were fabricated through a dry etching processing in an inductively coupled plasma (ICP) system. SEM images of the uniform vertically aligned silicon nanowire arrays show 50 to 100 nm nanowire diameter range and ~1.1 mum height. Field emission characteristics were tested in an ultra-high vacuum system. The electron emission turn-on field (Eto ) and threshold field (Eth) were obtained from current-electric field characteristic plot
  • Keywords
    annealing; electron field emission; elemental semiconductors; etching; nanotechnology; nanowires; plasma materials processing; scanning electron microscopy; semiconductor quantum wires; silicon; 50 to 100 nm; 75 degC; ICP; SEM; Si; current-electric field characteristic plot; dry etching; electron emission turn-on field; field emission; field emission characteristics; inductively coupled plasma system; nanomasks; nanowire diameter; nanowire fabrication; scanning electron micrography; thermal annealing; threshold field; ultra-high vacuum system; vertically aligned silicon nanowire arrays; Annealing; Dry etching; Fabrication; Nanoparticles; Nanowires; Plasma applications; Plasma temperature; Semiconductor films; Silicon alloys; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Vacuum Nanoelectronics Conference, 2006 and the 2006 50th International Field Emission Symposium., IVNC/IFES 2006. Technical Digest. 19th International
  • Conference_Location
    Guilin
  • Print_ISBN
    1-4244-0401-0
  • Type

    conf

  • DOI
    10.1109/IVNC.2006.335347
  • Filename
    4134454