DocumentCode
2040511
Title
The thermal analysis of drive circuit of High Speed On-Off Valve(HSV) based on Three Co-simulation
Author
Guirong Zhuo ; Hai Li
Author_Institution
Clean Energy Automotive Eng. Center, Tongji Univ., Shanghai, China
fYear
2015
fDate
2-5 Aug. 2015
Firstpage
588
Lastpage
592
Abstract
According to calculate the thermal power of drive circuit of High Speed On-Off Valve (HSV), This paper proposes a method to calculate thermal power of key element based on Three Co-simulation (Simulink-PSpice-AMESim). Firstly, the 2D and 3D model of HSV are established and the electromagnetic characteristics curve of HSV is obtained by Finite Element Analysis in ANSYS and then the accurate model of HSV is established with the electromagnetic characteristics and a complete hydraulic system model of ABS is built by AMESim. Secondly, the drive circuit of HSV controlled by PWM is designed. In this circuit, a resistance and a variable inductance whose size is controlled by the actual value tested in AMESim are used to alternative HSV, so that the model is largely close to the actual. Lastly, this paper builds the three co-simulation (Simulink-PSpice-AMESim) module and develops two control strategies of the system. This paper mainly calculates the thermal power of key electronic components in drive circuit of HSV with different control strategies (BANG-BANG Control and PID-Sliding Control). The method of thermal analysis has taken the full advantage of the professional software of corresponding module, so the results are close to the actual situation.
Keywords
bang-bang control; control engineering computing; digital simulation; finite element analysis; hydraulic control equipment; on-off control; pulse width modulation; road vehicles; three-term control; valves; variable structure systems; ABS hydraulic system model; ANSYS; HSV 2D model; HSV 3D model; PID-sliding control; PWM; Simulink-PSpice-AMESim cosimulation; bang-bang control; drive circuit thermal analysis; finite element analysis; high speed on-off valve; Finite element analysis; Inductance; Integrated circuit modeling; MOSFET; Solid modeling; Thermal analysis; Valves; HSV; SLPS; thermal analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Mechatronics and Automation (ICMA), 2015 IEEE International Conference on
Conference_Location
Beijing
Print_ISBN
978-1-4799-7097-1
Type
conf
DOI
10.1109/ICMA.2015.7237551
Filename
7237551
Link To Document