DocumentCode
2040556
Title
Analysis of Horizontal and Vertical Couplings in Bonding Wire Interconnections Using EFIE with Cylindrical Conduction Mode Basis Functions
Author
Han, Ki Jin ; Swaminathan, Madhavan ; Engin, Ege
Author_Institution
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA
fYear
2008
fDate
12-15 May 2008
Firstpage
1
Lastpage
4
Abstract
To clarify the initial step of 3-D interconnection design, this paper shows electrical characteristics of vertically and horizontally coupled bonding wire interconnections. For efficient analysis, solving EFIE with cylindrical CMBF is used, and additional approximation methods and matrix manipulation are discussed.
Keywords
electric field integral equations; integrated circuit interconnections; 3D interconnection design; EFIE; bonding wire interconnections; cylindrical conduction mode basis functions; horizontal couplings; vertical couplings; Bonding; Conductors; Coupling circuits; Electric variables; Electromagnetic coupling; Electromagnetic modeling; Equivalent circuits; Frequency; Integrated circuit interconnections; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Signal Propagation on Interconnects, 2008. SPI 2008. 12th IEEE Workshop on
Conference_Location
Avignon
Print_ISBN
978-1-4244-2317-0
Electronic_ISBN
978-1-4244-2318-7
Type
conf
DOI
10.1109/SPI.2008.4558394
Filename
4558394
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