Title :
Analysis of Horizontal and Vertical Couplings in Bonding Wire Interconnections Using EFIE with Cylindrical Conduction Mode Basis Functions
Author :
Han, Ki Jin ; Swaminathan, Madhavan ; Engin, Ege
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA
Abstract :
To clarify the initial step of 3-D interconnection design, this paper shows electrical characteristics of vertically and horizontally coupled bonding wire interconnections. For efficient analysis, solving EFIE with cylindrical CMBF is used, and additional approximation methods and matrix manipulation are discussed.
Keywords :
electric field integral equations; integrated circuit interconnections; 3D interconnection design; EFIE; bonding wire interconnections; cylindrical conduction mode basis functions; horizontal couplings; vertical couplings; Bonding; Conductors; Coupling circuits; Electric variables; Electromagnetic coupling; Electromagnetic modeling; Equivalent circuits; Frequency; Integrated circuit interconnections; Wire;
Conference_Titel :
Signal Propagation on Interconnects, 2008. SPI 2008. 12th IEEE Workshop on
Conference_Location :
Avignon
Print_ISBN :
978-1-4244-2317-0
Electronic_ISBN :
978-1-4244-2318-7
DOI :
10.1109/SPI.2008.4558394
