Title :
Opens board test coverage: when is 99% really 40%?
Author :
Tegethoff, Mick M V ; Parker, Kenneth P. ; Lee, Ken
Author_Institution :
Manuf. Test Div., Hewlett-Packard Co., Loveland, CO, USA
Abstract :
In this paper we discuss board test coverage of opens for power pins of large ASICs soldered to electronic boards. Multiple power pin connections cannot be tested by typical electrical testing techniques because they are connected in parallel between the package and the board. We present in this paper an estimate of the probability of these power pin opens, outline the impact of the lack of test coverage in system performance, and offer possible solutions to the problem,
Keywords :
application specific integrated circuits; integrated circuit testing; printed circuit testing; probability; statistical analysis; IC power pins; board-mounted ASIC; electrical testing; electronic boards; large ASICs; multiple power pin connections; opens board test coverage; probability; Circuit faults; Circuit testing; Electronic equipment testing; Electronics packaging; Frequency; Laboratories; Pins; Power supplies; Power system modeling; System testing;
Conference_Titel :
Test Conference, 1996. Proceedings., International
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-3541-4
DOI :
10.1109/TEST.1996.556979
