Abstract :
The following topics are dealt with: solder materials; design engineering; through silicon via; reliability; LED; power electronics; nanotechnology; integrated circuit interconnection; and integrated circuit bonding.
Keywords :
design engineering; integrated circuit bonding; integrated circuit interconnections; light emitting diodes; nanotechnology; power electronics; reliability; solders; three-dimensional integrated circuits; LED; design engineering; integrated circuit bonding; integrated circuit interconnection; nanotechnology; power electronics; reliability; solder materials; through silicon via;
Conference_Titel :
Electronic Materials and Packaging (EMAP), 2012 14th International Conference on
Conference_Location :
Lantau Island
Print_ISBN :
978-1-4673-4945-1
Electronic_ISBN :
978-1-4673-4943-7
DOI :
10.1109/EMAP.2012.6507826
