DocumentCode :
2041936
Title :
Laminates for MEMS and BioMEMS
Author :
Bachman, Mark ; Li, G.-P.
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., Univ. of California, Irvine, Irvine, CA, USA
fYear :
2012
fDate :
13-16 Dec. 2012
Firstpage :
1
Lastpage :
5
Abstract :
This paper describes a new way to build MEMS and BioMEMS devices using laminate technologies borrowed from the packaging industry. This approach to building MEMS departs from the traditional silicon approach, and offers many advantages, including the ability to design and build the package at the same time as the device itself. The use of MEMS fabrication techniques, combined with microelectronics manufacturing technology allows a host of integrated devices to be built using novel materials and processes. This frees the MEMS designer from the significant limitations imposed by silicon and its related materials and processes. Devices can be built that are intended for high power applications, optical applications, or biomedical applications.
Keywords :
bioMEMS; electronics packaging; integrated circuit manufacture; laminates; microfabrication; MEMS fabrication techniques; bioMEMS devices; biomedical applications; high power applications; integrated devices; laminate technology; microelectronics manufacturing technology; optical applications; packaging industry;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Materials and Packaging (EMAP), 2012 14th International Conference on
Conference_Location :
Lantau Island
Print_ISBN :
978-1-4673-4945-1
Electronic_ISBN :
978-1-4673-4943-7
Type :
conf
DOI :
10.1109/EMAP.2012.6507843
Filename :
6507843
Link To Document :
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