Title :
Supply chains for 3D IC integration manufacturing
Author_Institution :
Electron. & Optoelectron. Res. Lab., Ind. Technol. Res. Inst. (ITRI), Hsinchu, Taiwan
Abstract :
The supply chains for 3D IC integration manufacturing are studied in this investigation. Emphasis is placed on the ownerships of the technology supply chains such as the FEOL (front-end-of-line), MOL (middle-of-the-line), BEOL (back-end-of-line), TSV (through-silicon via), MEOL (middle-end-of-line), and package assembly and test. Some recommendations will be provided.
Keywords :
integrated circuit manufacture; integrated circuit packaging; supply chains; three-dimensional integrated circuits; 3D IC integration manufacturing; BEOL; FEOL; MEOL; MOL; TSV; back-end-of-line; front-end-of-line; middle-end-of-line; middle-of-the-line; package assembly; supply chains; through-silicon via;
Conference_Titel :
Electronic Materials and Packaging (EMAP), 2012 14th International Conference on
Conference_Location :
Lantau Island
Print_ISBN :
978-1-4673-4945-1
Electronic_ISBN :
978-1-4673-4943-7
DOI :
10.1109/EMAP.2012.6507848
