Effect of additive elements on tensile, creep and low cycle fatigue strength for SnBi solders

Author

Nakano, Shunsuke ; Sakane, M. ; Hokazono, Hiroaki ; Yamashita, Masaru

Author_Institution

Dept. of Sci. & Eng, Ritsumeikan Univ., Kusatsu, Japan

fYear

2012

fDate

13-16 Dec. 2012

Firstpage

1

Lastpage

5

Abstract

This paper presents tensile, creep and low cycle fatigue properties of three kinds of SnBi lead-free solders. Tensile, creep and low cycle fatigue tests were performed using miniature specimens of the three solders. The effects of additive elements on tensile, creep and fatigue properties were discussed. Three kinds of solders showed almost the same tensile strength of around 55MPa and the same tensile ductility of about 70%. The creep rupture lifetimes of Sn57.5Bi0.5AgCuNiGe were about 1.5 - 2 times longer than those of Sn58Bi and Sn57.5Bi0.5Ag solders at 313K, 353K and 373K. The three kinds of solders showed almost the same low cycle fatigue strength at 313K. These mechanical properties were discussed in relation with the microstructure.

Keywords

creep; creep testing; fatigue; fatigue testing; solders; surface mount technology; tensile strength; tin compounds; SnBiAgCuNiGe; additive elements; creep rupture lifetimes; creep test; lead-free solders; low-cycle fatigue strength; low-cycle fatigue test; mechanical properties; tensile ductility; tensile strength; tensile test;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Materials and Packaging (EMAP), 2012 14th International Conference on

Conference_Location

Lantau Island

Print_ISBN

978-1-4673-4945-1

Electronic_ISBN

978-1-4673-4943-7

Type

conf

DOI

10.1109/EMAP.2012.6507858

Filename

6507858