Title :
The interfacial interaction of Ti/Ni/Ag/Au multilayer under thermal cycling test
Author :
Fu-Jung Yeh ; Tsung-Chieh Chiu ; Kwang-Lung Lin
Author_Institution :
Dept. of Mater. Sci. & Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
Abstract :
The Ti/Ni/Ag/Au multilayers combination, intended for LED metallization was deposited on Si substrate for interfacial interaction study. The interfacial interactions of the Ti/Ni/Ag/Au multilayers was investigated under various periods of thermal cycling between -40°C and 125°C. The results of ESCA (Electron Spectroscopy for Chemical Analysis) depth profile analysis indicate that Ag atoms diffuse passing through the pure Au layer to the surface after thermal cycling. The outward diffusion of Ag atoms towards Au and Ni cause voids formation in the Ag layer.
Keywords :
ESCA; gold; light emitting diodes; metallisation; multilayers; nickel; silver; titanium; voids (solid); ESCA; LED metallization; Si; Ti-Ni-Ag-Au; depth profile analysis; electron spectroscopy for chemical analysis; interfacial interaction study; temperature -40 degC to 125 degC; thermal cycling test; voids formation;
Conference_Titel :
Electronic Materials and Packaging (EMAP), 2012 14th International Conference on
Conference_Location :
Lantau Island
Print_ISBN :
978-1-4673-4945-1
Electronic_ISBN :
978-1-4673-4943-7
DOI :
10.1109/EMAP.2012.6507860
