• DocumentCode
    2042515
  • Title

    Low Temperature Cooling by Thermal-Field Electron Emission in a Crossed-Field Gap

  • Author

    Lin, Wu ; Ang, L.K.

  • Author_Institution
    Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore
  • fYear
    2006
  • fDate
    38899
  • Firstpage
    229
  • Lastpage
    230
  • Abstract
    A new method of refrigeration using thermal-field electron emission from nano-scale emitters of arbitrary work function in a vacuum crossed-field gap is proposed. A sample potential profile V vs. x for a sharp emitter (cathode) with effective radius R=10 nm, work function phi=4 eV, emitter-collector separation of L=20 mum, dc voltage applied at anode Vg=420 v is shown. For a given emitter (fixed work function and radius), and gap spacing, an optimal magnetic field B0 can be determined for a given electric field F at various temperatures. To achieve maximum normalized cooling power density eta, a critical electric field Fc is extracted by varying F with its corresponding B0. It is found that the optimal local cooling power density per emitter is about 600 kW/cm2 at 300 K, 2.7 kW/cm2 at 50 K and 20 W/cm2 at 10 K. To measure the efficiency of the proposed cooling method, Peltier coefficient Pi and COP = Pi/Vg at various conditions are presented. Effects of space-charge effects are also discussed
  • Keywords
    Peltier effect; cooling; electron field emission; refrigeration; space charge; 10 K; 300 K; 50 K; Peltier coefficient; critical electric field; crossed-field gap; gap spacing; low temperature cooling; normalized cooling power density; optimal magnetic field; refrigeration; space-charge effects; thermal-field electron emission; Anodes; Cathodes; Cooling; Density measurement; Electron emission; Magnetic fields; Refrigeration; Temperature; Time of arrival estimation; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Vacuum Nanoelectronics Conference, 2006 and the 2006 50th International Field Emission Symposium., IVNC/IFES 2006. Technical Digest. 19th International
  • Conference_Location
    Guilin
  • Print_ISBN
    1-4244-0401-0
  • Type

    conf

  • DOI
    10.1109/IVNC.2006.335442
  • Filename
    4134544