• DocumentCode
    2042579
  • Title

    A facile fabrication method of silver lines on PET with good adhesion at room temperature

  • Author

    Yunxia Jin ; Dunying Deng ; Yuanrong Cheng ; Fei Xiao

  • Author_Institution
    Dept. of Mater. Sci., Fudan Univ., Shanghai, China
  • fYear
    2012
  • fDate
    13-16 Dec. 2012
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Flexible/foldable electronics will undoubtedly attract an increasing research interest in the future. Here we demonstrate a facile method to fabricate tunable micro-patterned silver line on PET film with good substrate adhesion based on mussel-inspired surface modification. The PET substrate was first modified with a catecholic adhesive layer by dip-coating in aqueous solution of dopamine at alkali condition for ten minutes. Then combination of photolithographic approach poly(dopamine) (PDA) pattern was developed on the PET film. Finally, silver was deposited only on the exposed PDA regions of the PET substrate by electroless plating without any catalyst or seed layer. This site-selective deposition process enabled the good adhesion of silver line on the flexible polymer substrate due to the multifunction of PDA, which acted as both affinity binder and reduction reagent. The silver lines thickness was uniform and their borders were smooth. Furthermore, the sheet resistance of the silver line was as low as 1.2 Ω/□ and didn´t show distinct alteration under foldable state.
  • Keywords
    adhesion; adhesives; dip coating; electroplating; flexible electronics; microfabrication; photolithography; polymer films; reduction (chemical); silver; PDA pattern; PET film; affinity binder; alkali condition; aqueous solution; catecholic adhesive layer; dip-coating; dopamine; electroless plating; facile fabrication method; flexible electronics; flexible polymer substrate; foldable electronics; mussel-inspired surface modification; photolithographic approach poly(dopamine) pattern; reduction reagent; sheet resistance; silver lines; site-selective deposition process; substrate adhesion; temperature 293 K to 298 K; tunable micropatterned silver line fabrication;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Materials and Packaging (EMAP), 2012 14th International Conference on
  • Conference_Location
    Lantau Island
  • Print_ISBN
    978-1-4673-4945-1
  • Electronic_ISBN
    978-1-4673-4943-7
  • Type

    conf

  • DOI
    10.1109/EMAP.2012.6507866
  • Filename
    6507866