• DocumentCode
    2042661
  • Title

    A BIST methodology for comprehensive testing of ram with reduced heat dissipation

  • Author

    Cheung, Hugo ; Gupta, Sandeep K.

  • Author_Institution
    Rockwell Serniconch.tctor Systems zK311 Jamboree Road, MS 502-101 Newport Beach, CA 92660-3095
  • fYear
    1996
  • fDate
    20-25 Oct. 1996
  • Firstpage
    386
  • Lastpage
    400
  • Abstract
    The severity of excessive heat dissipation during concurrent BIST of memory modules has been documented by V. Zorian ["A Distributed BIST Control Scheme For Complex VLSI Devices," IEEE VLSI Test Symposium, Mar. 1993, pp 4-9]. In this paper, we present new versions of several memory tests that reduce heat dissipation during testing. Each proposed test has the same fault coverage and time complexity as the original version but it reduces heat dissipation by a factor of two or more. For three of the tests, the heat dissipation is reduced by factors of four to sixteen. The design of BIST circuitry required to implement the proposed tests are presented and it is shown that additional area overhead incurred is very small.
  • Keywords
    Application specific integrated circuits; Built-in self-test; Circuit faults; Circuit testing; Costs; Hardware; Logic testing; Packaging; Random access memory; System testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Conference, 1996. Proceedings., International
  • Conference_Location
    Washington, DC, USA
  • ISSN
    1089-3539
  • Print_ISBN
    0-7803-3541-4
  • Type

    conf

  • DOI
    10.1109/TEST.1996.556985
  • Filename
    556985