DocumentCode
2042661
Title
A BIST methodology for comprehensive testing of ram with reduced heat dissipation
Author
Cheung, Hugo ; Gupta, Sandeep K.
Author_Institution
Rockwell Serniconch.tctor Systems zK311 Jamboree Road, MS 502-101 Newport Beach, CA 92660-3095
fYear
1996
fDate
20-25 Oct. 1996
Firstpage
386
Lastpage
400
Abstract
The severity of excessive heat dissipation during concurrent BIST of memory modules has been documented by V. Zorian ["A Distributed BIST Control Scheme For Complex VLSI Devices," IEEE VLSI Test Symposium, Mar. 1993, pp 4-9]. In this paper, we present new versions of several memory tests that reduce heat dissipation during testing. Each proposed test has the same fault coverage and time complexity as the original version but it reduces heat dissipation by a factor of two or more. For three of the tests, the heat dissipation is reduced by factors of four to sixteen. The design of BIST circuitry required to implement the proposed tests are presented and it is shown that additional area overhead incurred is very small.
Keywords
Application specific integrated circuits; Built-in self-test; Circuit faults; Circuit testing; Costs; Hardware; Logic testing; Packaging; Random access memory; System testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Conference, 1996. Proceedings., International
Conference_Location
Washington, DC, USA
ISSN
1089-3539
Print_ISBN
0-7803-3541-4
Type
conf
DOI
10.1109/TEST.1996.556985
Filename
556985
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