The thermal performance of PCR chip with copper target ion beam sputtering deposition on the ceramic peltier

In this study, the copper target ion beam sputtering deposition (CTIBSD) method was used for improving the thermal performance of commercial ceramic peltier and several PCR chips were made of NOA81 in few minutes by UV soft lithography technology. The thermal uniformity and heat transfer rate were simulated by Comsol to investigate the improved effect of coppering peltier. In addition, the thermal distribution on the peltiers with different thickness copper film were measured through the line average temperature measuring method. The cooling rate of the PCR chip with coppering Peltier also was tested according to the PCR program. The results of the simulation and measurement showed that the CTIBSD method could greatly improve the thermal performance of Peltier and the PCR time of the PCR chip could be reduced by the increasing of the heat transfer rate. An practical application in gene amplification was realized successfully on the PCR chip which the heat resource supporting by the coppering Peltier. With the excellent thermal performance of coppering Peltier, the novel NOA81 chip could apply in field of POCT (Point of care testing) and forensic analysis in the future.