DocumentCode
2043189
Title
Convenient fabrication of composites with aqueous synthesized quantum dots for LED encapsulation
Author
Lei Zhang ; Haibin Chen ; Jingshen Wu
Author_Institution
Center for Eng. Mater. & Reliability, Hong Kong Univ. of Sci. & Technol., Hong Kong, China
fYear
2012
fDate
13-16 Dec. 2012
Firstpage
1
Lastpage
5
Abstract
Organic approach is commercialized for fabrication of quantum dots (QDs) with the defects of high reagents expense, severe reaction conditions, toxic reaction residue etc. Although aqueous synthesis QDs has bad compatibility with common LEDs encapsulation material, like silicone and epoxy, it is relatively low cost, environmental friendly and simple. In this article, undoped and doped CdS were prepared through aqueous solution synthesis with 3-mercaptopropionic acid used as stabilizing agent. Convenient silica coating method was developed and mixed with silicone before curing since termination would occur when QDs were directly mixed with commercial silicone due to catalyst poisoning. Besides, quaternary ammonium salt was applied for fabricating QD-epoxy composite, which did not observe phase separation. The method is simple for acquiring the QDs without emission wavelength shift or quenching comparing with classical methods. The two methods can be guidances for assistance the development of LED with aqueous synthesized QDs.
Keywords
II-VI semiconductors; cadmium compounds; coatings; curing; nanocomposites; nanofabrication; resins; semiconductor quantum dots; silicon compounds; silicones; wide band gap semiconductors; 3-mercaptopropionic acid; CdS; LED encapsulation; QD-epoxy composite; SiO2; aqueous solution synthesis; aqueous synthesized quantum dots; catalyst poisoning; commercial silicone; curing; quaternary ammonium salt; silica coating; stabilizing agent;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Materials and Packaging (EMAP), 2012 14th International Conference on
Conference_Location
Lantau Island
Print_ISBN
978-1-4673-4945-1
Electronic_ISBN
978-1-4673-4943-7
Type
conf
DOI
10.1109/EMAP.2012.6507889
Filename
6507889
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