DocumentCode :
2043419
Title :
Mechanical fastening to enable room temperature packaging for LOCs based on biocompatible hydrogel thin film
Author :
Weiwei Zhao ; Changqing Liu ; Lenardi, Cristina ; Santaniello, T. ; Fengshun Wu
Author_Institution :
Loughborough Univ., Loughborough, UK
fYear :
2012
fDate :
13-16 Dec. 2012
Firstpage :
1
Lastpage :
5
Abstract :
This paper reports a microfabrication technique viable for the production of microfluidic devices which can be reusable through disassembly and re-assembly routines using mechanical fastening configuration. A biocompatible water swollen poly (hydroxyethyl methacrylate) (PHEMA) hydrogel thin film of thickness ranging from 200 to 1000 μm is incorporated in a thermoplastic based multilayer system, as such its effectiveness of sealing is investigated through liquid leakage tests. In the test, pressurized air is injected in liquid filled microchannels machined on the hard polymeric component and sealed on one side by a compressed PHEMA layer. The critical pressure values of the fluid corresponding to the leakage at the materials´ interface have been registered for different hydrogel strain values and multiple microchannels depth. A COMSOL simulation has also been implemented to simulate the mechanical behaviour of the hydrogel in the custom device settings for different packaging and critical fluid flow pressure values.
Keywords :
bioMEMS; electronics packaging; hydrogels; joining processes; lab-on-a-chip; microfabrication; polymers; thin films; COMSOL simulation; LOC; biocompatible hydrogel thin film; biocompatible water swollen poly(hydroxyethyl methacrylate); compressed PHEMA layer; critical fluid flow pressure values; hard polymeric component; hydrogel strain values; hydrogel thin film; lab-on-chip systems; liquid filled microchannels; liquid leakage tests; mechanical behaviour simulation; mechanical fastening configuration; microfabrication technique; microfluidic device production; multiple microchannels depth; pressurized air; room temperature packaging; sealing; size 200 mum to 1000 mum; temperature 293 K to 298 K; thermoplastic based multilayer system;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Materials and Packaging (EMAP), 2012 14th International Conference on
Conference_Location :
Lantau Island
Print_ISBN :
978-1-4673-4945-1
Electronic_ISBN :
978-1-4673-4943-7
Type :
conf
DOI :
10.1109/EMAP.2012.6507899
Filename :
6507899
Link To Document :
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