Low-temperature bonding method based on metallic microcone array for interconnection application

Author

Qin Lu ; Zhuo Chen ; Liming Gao ; Ming Li

Author_Institution

Sch. of Mater. Sci. & Eng., Shanghai Jiao Tong Univ., Shanghai, China

fYear

2012

fDate

13-16 Dec. 2012

Firstpage

1

Lastpage

4

Abstract

Stacked bonding has become one of the key technologies of 3D IC. This paper reports a low-temperature solid state bonding method based on metallic microcone array for potential use in 3D integration applications. Sn-3.0Ag-0.5Cu solder balls with 760 μm diameter were used for the low-temperature BGA bonding. Ni micro cone layer was prepared by electro deposition and Cu micro cone layer was deposited by electroless plating, respectively. Bonding joints were shear tested to evaluate the joint strength of samples bonded at each pressure and temperature. Microscopic observation showed sufficient insertion between Sn and cone-structured Ni or Cu. Results showed that bonding strength was superior with proper bonding conditions.

Keywords

ball grid arrays; copper alloys; electroplating; integrated circuit bonding; integrated circuit interconnections; low-temperature techniques; silver alloys; three-dimensional integrated circuits; tin alloys; 3D IC; 3D integration applications; Sn-Ag-Cu; bonding joints; bonding strength; electroless plating; interconnection application; low-temperature BGA bonding; low-temperature bonding method; low-temperature solid state bonding method; metallic microcone array; microcone layer; microscopic observation; shear testing; size 760 mum; solder balls; stacked bonding;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Materials and Packaging (EMAP), 2012 14th International Conference on

Conference_Location

Lantau Island

Print_ISBN

978-1-4673-4945-1

Electronic_ISBN

978-1-4673-4943-7

Type

conf

DOI

10.1109/EMAP.2012.6507901

Filename

6507901