Low temperature bonding of piezoelectric single crystal materials for miniaturized high resolution ultrasound transducers

Author

Ng, Jack H-G ; SSekitoleko, R.T. ; Hoang-Vu Nguyen ; Aasmundtveit, Knut E. ; Demore, Christine E. M. ; Cochran, Sandy ; Desmulliez, Marc Philippe Y.

Author_Institution

Inst. of Sensors, Signals & Syst. (ISSS), Heriot-Watt Univ., Edinburgh, UK

fYear

2012

fDate

13-16 Dec. 2012

Firstpage

1

Lastpage

4

Abstract

The realization of the next-generation miniaturized ultrasound transducers comprising of fine pitch array elements requires packaging techniques used in the microelectronics industry. In addition, new types of piezoelectric materials are used to enhance the acoustic performance of these transducers, but these materials cannot withstand the temperature and pressure applied in conventional bonding technologies. This paper explored two different bonding techniques specifically to address this issue.

Keywords

crystals; fine-pitch technology; integrated circuit bonding; integrated circuit packaging; low-temperature techniques; piezoelectric materials; ultrasonic transducers; acoustic performance; fine pitch array elements; low temperature bonding techniques; microelectronics industry; miniaturized high resolution ultrasound transducers; next-generation miniaturized ultrasound transducers; packaging techniques; piezoelectric single crystal materials;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Materials and Packaging (EMAP), 2012 14th International Conference on

Conference_Location

Lantau Island

Print_ISBN

978-1-4673-4945-1

Electronic_ISBN

978-1-4673-4943-7

Type

conf

DOI

10.1109/EMAP.2012.6507902

Filename

6507902