Title :
Low temperature bonding of piezoelectric single crystal materials for miniaturized high resolution ultrasound transducers
Author :
Ng, Jack H-G ; SSekitoleko, R.T. ; Hoang-Vu Nguyen ; Aasmundtveit, Knut E. ; Demore, Christine E. M. ; Cochran, Sandy ; Desmulliez, Marc Philippe Y.
Author_Institution :
Inst. of Sensors, Signals & Syst. (ISSS), Heriot-Watt Univ., Edinburgh, UK
Abstract :
The realization of the next-generation miniaturized ultrasound transducers comprising of fine pitch array elements requires packaging techniques used in the microelectronics industry. In addition, new types of piezoelectric materials are used to enhance the acoustic performance of these transducers, but these materials cannot withstand the temperature and pressure applied in conventional bonding technologies. This paper explored two different bonding techniques specifically to address this issue.
Keywords :
crystals; fine-pitch technology; integrated circuit bonding; integrated circuit packaging; low-temperature techniques; piezoelectric materials; ultrasonic transducers; acoustic performance; fine pitch array elements; low temperature bonding techniques; microelectronics industry; miniaturized high resolution ultrasound transducers; next-generation miniaturized ultrasound transducers; packaging techniques; piezoelectric single crystal materials;
Conference_Titel :
Electronic Materials and Packaging (EMAP), 2012 14th International Conference on
Conference_Location :
Lantau Island
Print_ISBN :
978-1-4673-4945-1
Electronic_ISBN :
978-1-4673-4943-7
DOI :
10.1109/EMAP.2012.6507902
