• DocumentCode
    2043515
  • Title

    A quicker and reliable screening method for thermal classification of insulating materials

  • Author

    Pandya, N.R. ; Shrinet, V.

  • Author_Institution
    Electr. R&D Assoc., Vadodara, India
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    70
  • Lastpage
    72
  • Abstract
    Correct knowledge of the thermal class of insulating materials is very important for efficient and optimal application in electrical equipment. Methods recommended in specifications (e.g. IEC-216) for evaluation of the thermal class need a long duration of about ten months. Often it is not convenient to wait for such a long period. Furthermore the specified method also requires a large quantity of energy, man hours and samples, and is expensive. Therefore, there is a need to develop a quicker but reliable method which at least can be used for screening purposes. This will enable the insulating material manufacturer to develop better material in a shorter time and users to identify appropriate material among a variety of insulating materials available on the market. The advent of modern analytical tools e.g. Thermogravimetric analysis (TGA) provides an appropriate tool in this regard, Several attempts hare been made in this direction. The three major approaches namely, DiCerbo, TPS and Toop methods have some limitations. In the proposed procedure an attempt has been made to overcome previous short comings. This method suggests that activation energy only in the degradation zone shall be considered for the evaluation. The observed results have shown good correlation with data observed from conventional method
  • Keywords
    insulation testing; thermal analysis; thermal insulating materials; activation energy; electrical equipment; insulating materials; screening method; thermal classification; thermogravimetric analysis; Aging; Dielectrics and electrical insulation; Manufacturing; Materials reliability; Research and development; Temperature; Thermal conductivity; Thermal degradation; Thermal factors; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation, 2000. Conference Record of the 2000 IEEE International Symposium on
  • Conference_Location
    Anaheim, CA
  • ISSN
    1089-084X
  • Print_ISBN
    0-7803-5931-3
  • Type

    conf

  • DOI
    10.1109/ELINSL.2000.845439
  • Filename
    845439