Title :
Solder volume effects on fatigue life of BGA structure Cu/Sn-3.0Ag-0.5Cu/Cu interconnects
Author :
Hong-Bo Qin ; Xun-Ping Li ; Xin-Ping Zhang
Author_Institution :
Sch. of Mater. Sci. & Eng., South China Univ. of Technol., Guangzhou, China
Abstract :
The influence of solder volume on fatigue life of BGA structure Cu/Sn-3.0Ag-0.5Cu/Cu interconnects of different standoff heights under displacement cyclic loading conditions was studied by finite element (FE) simulation. The geometry of BGA structure solder interconnect was predicted according to the minimum energy principle by FE analysis, and simulation results reveal that the influence of gravity on the geometry of BGA structure solder interconnects can be reasonably ignored when the diameters of solder balls used are less than 0.76 mm. Darveaux´s methodology based on plastic strain energy density was employed to predict the fatigue life of solder interconnects of different volumes by FE method. The simulation results show that the decreasing standoff height (i.e., solder volume) of joints can obviously increase the fatigue life of BGA structure solder interconnects, and the value and distribution of accumulated equivalent plastic strain play critical roles in determining the fatigue life of BGA structure solder interconnects.
Keywords :
ball grid arrays; copper; fatigue; finite element analysis; plastic deformation; silver; solders; tin; BGA structure interconnects; BGA structure solder interconnect geometry; Cu-Sn-Ag-Cu-Cu; Darveaux methodology; FE analysis; FE method; accumulated equivalent plastic strain; displacement cyclic loading conditions; fatigue life; finite element simulation; minimum energy principle; plastic strain energy density; solder ball diameters; solder interconnects; solder volume effects; standoff height;
Conference_Titel :
Electronic Materials and Packaging (EMAP), 2012 14th International Conference on
Conference_Location :
Lantau Island
Print_ISBN :
978-1-4673-4945-1
Electronic_ISBN :
978-1-4673-4943-7
DOI :
10.1109/EMAP.2012.6507908
