• DocumentCode
    2044874
  • Title

    An experimental approach to the estimation of the long term corona performance of non-ceramic insulator housings

  • Author

    Moreno, Victor M. ; Goror, R.S.

  • Author_Institution
    Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    193
  • Lastpage
    196
  • Abstract
    This paper presents the results from a study on the synergistic effects of corona, humidity and mechanical stresses on the degradation of non-ceramic insulator (NCI) housing materials. Three different polymer formulations, namely silicone rubber (SIR), ethylene propylene diene monomer (EPDM) and a mixture of both were evaluated in a test cell and the surface changes resulting from degradation were monitored. Under the experimental conditions adopted in this study, varying degrees of polymer degradation were observed for each material group. A strong influence of humidity on the development of degradation processes was identified. By computing cumulative charge magnitudes up to the time when surface cracking was detected, a simplistic correlation with expected field operating conditions seems to indicate that even under severe circumstances (corona continuously impinging at the same site) degradation similar to that observed in this unlikely to occur for field exposure times amounting to many years
  • Keywords
    corona; ethylene-propylene rubber; silicone rubber insulators; SIR-EPDM mixture; corona discharge; ethylene propylene diene monomer; humidity; mechanical stress; nonceramic insulator housing; polymer degradation; silicone rubber; surface cracking; synergistic effect; Corona; Dielectrics and electrical insulation; Electrodes; Fault location; Humidity; Polymers; Stress; Surface discharges; Testing; Thermal degradation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation, 2000. Conference Record of the 2000 IEEE International Symposium on
  • Conference_Location
    Anaheim, CA
  • ISSN
    1089-084X
  • Print_ISBN
    0-7803-5931-3
  • Type

    conf

  • DOI
    10.1109/ELINSL.2000.845487
  • Filename
    845487