Title :
Reduction of FePt ordering temperature by Cu underlayer on Si
Author :
Chih-Huang Lai ; Tseng, T.K.
Author_Institution :
Dept. of Mater. Sci. & Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
fDate :
March 30 2003-April 3 2003
Abstract :
In this paper, we have investigated the diffusion effects of Cu and Si from underlayers and substrates, respectively, on the ordering temperature and magnetic properties of FePt films.
Keywords :
coercive force; copper; diffusion; elemental semiconductors; ferromagnetic materials; iron alloys; magnetic thin films; platinum alloys; silicon; substrates; FePt films; FePt ordering temperature; FePt-Cu; SiO/sub 2/-Si; diffusion; magnetic properties; Anisotropic magnetoresistance; Annealing; Coercive force; Magnetic films; Magnetic properties; Semiconductor films; Sputtering; Temperature; Transistors; X-ray scattering;
Conference_Titel :
Magnetics Conference, 2003. INTERMAG 2003. IEEE International
Conference_Location :
Boston, MA, USA
Print_ISBN :
0-7803-7647-1
DOI :
10.1109/INTMAG.2003.1230430
