DocumentCode
2045749
Title
Reduction of FePt ordering temperature by Cu underlayer on Si
Author
Chih-Huang Lai ; Tseng, T.K.
Author_Institution
Dept. of Mater. Sci. & Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
fYear
2003
fDate
March 30 2003-April 3 2003
Abstract
In this paper, we have investigated the diffusion effects of Cu and Si from underlayers and substrates, respectively, on the ordering temperature and magnetic properties of FePt films.
Keywords
coercive force; copper; diffusion; elemental semiconductors; ferromagnetic materials; iron alloys; magnetic thin films; platinum alloys; silicon; substrates; FePt films; FePt ordering temperature; FePt-Cu; SiO/sub 2/-Si; diffusion; magnetic properties; Anisotropic magnetoresistance; Annealing; Coercive force; Magnetic films; Magnetic properties; Semiconductor films; Sputtering; Temperature; Transistors; X-ray scattering;
fLanguage
English
Publisher
ieee
Conference_Titel
Magnetics Conference, 2003. INTERMAG 2003. IEEE International
Conference_Location
Boston, MA, USA
Print_ISBN
0-7803-7647-1
Type
conf
DOI
10.1109/INTMAG.2003.1230430
Filename
1230430
Link To Document