• DocumentCode
    2046404
  • Title

    Analysis of partial discharge patterns from a rod to plane arrangement

  • Author

    Chang, C. ; Su, Q.

  • Author_Institution
    Dept. of Electr. & Comput. Syst. Eng., Monash Univ., Clayton, Vic., Australia
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    439
  • Lastpage
    443
  • Abstract
    Partial discharges (PDs) in high-voltage insulating systems may originate from various defects. It is important to identify the type of these insulation defects for instance internal discharges, surface discharges, corona, etc. In the past decade, PD identification research work has been carried out in a way of extracting fingerprints mainly from Phase Resolved and/or PD Magnitude Resolved distribution patterns. Generally, a PD process can be treated as a stochastic process consisting of short duration discharges and charge carrier drift/recombination intervals between these discharges. However, the complexity of PD process makes it difficult to link the PD stochastic process and the measured distribution pattern. The proposed approach yields possibilities for the interpretation of PD physical process using Voltage Resolved PD distribution (VRPD) patterns. Features of VRPD can be computed from the measurable quantities and the information about the discharge physics can be analytically obtained from calculated parameters
  • Keywords
    insulation testing; partial discharges; corona; defect detection; high voltage insulation; internal discharge; partial discharge; rod-plane electrode system; stochastic process; surface discharge; voltage resolved PD distribution pattern; Charge carriers; Corona; Fingerprint recognition; Insulation; Partial discharges; Pattern analysis; Stochastic processes; Surface discharges; Surface treatment; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation, 2000. Conference Record of the 2000 IEEE International Symposium on
  • Conference_Location
    Anaheim, CA
  • ISSN
    1089-084X
  • Print_ISBN
    0-7803-5931-3
  • Type

    conf

  • DOI
    10.1109/ELINSL.2000.845543
  • Filename
    845543