Title :
Semiconductor packaging technology for mobile phones in Japan
Author_Institution :
Hitachi Cable, Ltd., Tokyo, Japan
Abstract :
In semiconductor packaging technology for mobile phones, rapid development in materials, structures, manufacturing methods, and design architecture are making it possible to create phones with higher density, lighter weight, and better performance than ever before. Innovations in polymer materials are largely responsible for such improvements. Future-generation mobile phones are required to keep up with wireless communications on higher-speed transmission. Due to this requirement, the mobile phone industry expects engineers to develop new polymer materials capable of keeping circuitry free from electrical noise even under high-speed operation.
Keywords :
ball grid arrays; chip scale packaging; fine-pitch technology; large scale integration; mobile radio; telephone sets; Japan; electrical noise; high-speed operation; mobile phones; packaging design architecture; packaging manufacturing methods; packaging materials; packaging structures; phone density; phone performance; phone weight; polymer materials; semiconductor packaging technology; transmission speed; wireless communications; Circuits; Design methodology; Mobile handsets; Plastics industry; Polymers; Semiconductor device manufacture; Semiconductor device packaging; Semiconductor materials; Technological innovation; Wireless communication;
Conference_Titel :
Polymers and Adhesives in Microelectronics and Photonics, 2001. First International IEEE Conference on
Conference_Location :
Potsdam, Germany
Print_ISBN :
0-7803-7220-4
DOI :
10.1109/POLYTR.2001.973249
