Title :
Effect of HVDC stress on breakdown strength and partial discharge activity of lapped thin film insulation
Author :
Sanden, Bjnrrn ; Haave, Terje
Author_Institution :
Dept. of Electr. Power Eng., Norwegian Univ. of Sci. & Technol., Trondheim, Norway
Abstract :
In this paper results from measurement of electrical breakdown strength and partial discharge activity of samples comprised of polypropylene films is presented. Breakdown testing of 1-film samples using a linearly increasing voltage shows that the breakdown strength is reduced by 15% in the temperature range from 20 to 100°C. Impulse breakdown testing of 1- and 5-film samples show that the 1-film samples have significantly higher breakdown strength. Prestressing with 50 and 150 kV/mm result in reduced breakdown strength for both aiding and opposing polarities for 1-film samples, whereas no effect is observed for the 5-film samples. Measurement of partial discharge activity of samples with an artificial void of varying diameter, show that the discharge activity is dependent on the area of the void and on the time of voltage application
Keywords :
electric strength; insulation testing; organic insulating materials; partial discharges; polymer films; power cable insulation; space charge; 20 to 100 C; HVDC stress effect; artificial void; biaxially oriented films; breakdown strength; impulse breakdown testing; lapped thin film insulation; linearly increasing voltage; partial discharge activity; prestressing; Area measurement; Breakdown voltage; Electric breakdown; Electric variables measurement; HVDC transmission; Impulse testing; Partial discharge measurement; Partial discharges; Stress; Temperature distribution;
Conference_Titel :
Electrical Insulation, 2000. Conference Record of the 2000 IEEE International Symposium on
Conference_Location :
Anaheim, CA
Print_ISBN :
0-7803-5931-3
DOI :
10.1109/ELINSL.2000.845553
