DocumentCode :
2046684
Title :
Development of polymeric insulating materials for HVDC cables using additives: evidence from a multitude of experiments using different techniques
Author :
Khalil, M. Salah ; Jervase, J.A.
Author_Institution :
Dept. of Electr. & Electron. Eng., Sultan Qaboos Univ., Muscat, Oman
fYear :
2000
fDate :
2000
Firstpage :
485
Lastpage :
488
Abstract :
The main objective of the present paper is to shed more light on the multiple effects of the incorporation of certain additives into LDPE (low density polyethylene) on some of the properties of the doped material relevant to its use as an insulating material for HVDC cables. In the present work, the effects of two additives on DC insulation resistivity, DC breakdown strength, space charge accumulation under DC conditions, polymer structure and morphology were investigated using different techniques. Results of a multitude of experiments are presented and discussed. It is concluded that, although the incorporation of the additives may lead to certain beneficial effects such as the reduction of space charge density in the polymer and the improvement of the dependence of the DC insulation resistivity on temperature and electric field, yet the DC breakdown strength as well as the DC insulation resistivity itself may be reduced. It is also shown that the incorporation of the additives have a significant effect on the morphology of the doped material
Keywords :
electric breakdown; electric strength; electrical resistivity; insulation testing; polyethylene insulation; polymer structure; power cable insulation; space charge; DC breakdown strength; DC insulation resistivity; DSC; HVDC cables; LDPE; Weibull plots; additives effect; morphology; polymer structure; polymeric insulating materials; space charge accumulation; Additives; Cable insulation; Cables; Conductivity; Electric breakdown; HVDC transmission; Morphology; Plastic insulation; Polymers; Space charge;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation, 2000. Conference Record of the 2000 IEEE International Symposium on
Conference_Location :
Anaheim, CA
ISSN :
1089-084X
Print_ISBN :
0-7803-5931-3
Type :
conf
DOI :
10.1109/ELINSL.2000.845554
Filename :
845554
Link To Document :
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