Title :
Reliability studies of an isotropic electrically conductive adhesive
Author :
Morris, James E. ; Anderssohn, Falk ; Kudtarkar, Santosh ; Loos, Enrico
Author_Institution :
Dept. of Electr. & Comput. Eng., Portland State Univ., OR, USA
Abstract :
ICA reliability continues to be a source of concern for widespread practical implementations in commercial products. In addition, there is still much to be understood in the basic principles of how such materials function. This paper includes contributions in both areas, in further understanding of ICA size effects, in the interpretation of the beneficial effects of vacuum treatments before curing, with additional drop test data, and with critical comments on common electrical test techniques.
Keywords :
adhesives; assembling; circuit reliability; circuit testing; conducting polymers; filled polymers; heat treatment; packaging; size effect; vacuum techniques; ICA reliability; ICA size effects; commercial products; curing; drop test data; electrical test techniques; isotropic electrically conductive adhesive; materials function; reliability; vacuum treatments; Conductive adhesives; Conductivity; Contacts; Corrosion; Curing; Electric resistance; Galvanizing; Independent component analysis; Materials testing; Silver;
Conference_Titel :
Polymers and Adhesives in Microelectronics and Photonics, 2001. First International IEEE Conference on
Conference_Location :
Potsdam, Germany
Print_ISBN :
0-7803-7220-4
DOI :
10.1109/POLYTR.2001.973258
