Non-migration conductive adhesives

Author

Shirai, Yukio ; Komagata, Mitinori ; Suzuki, Kenichi

Author_Institution

NAMICS Corp., Niigata, Japan

fYear

2001

fDate

21-24 Oct. 2001

Firstpage

79

Lastpage

83

Abstract

Ag filled isotropic conductive adhesives (ICAs) have been investigated as promising alternatives to lead-containing solders in surface mount technology (SMT) applications. However, one serious concern is the electromigration of silver filled ICAs, especially when used in high density interconnection assembly. This paper investigates electromigration resistance of ICAs using Ag-Sn alloys as conductive fillers. It was found that electromigration resistance depends on Ag:Sn ratios and that Ag-Sn alloys containing 25/spl sim/75 mol% of Sn have excellent resistance. These new ICAs and conventional ICAs (as reference) were evaluated for SMT, using chip components with several kinds of terminations for their stability of contact resistance and adhesion strength during reliability tests. From the test results, it can be concluded that the new ICAs are suitable potential materials for SMT application.

Keywords

adhesives; assembling; conducting polymers; electromigration; filled polymers; printed circuit manufacture; printed circuit testing; silver alloys; surface mount technology; tin alloys; Ag; Ag filled ICAs; Ag filled isotropic conductive adhesives; Ag-Sn alloy conductive fillers; Ag:Sn ratio; AgSn; ICAs; SMT applications; SMT chip components; adhesion strength stability; chip component terminations; conductive adhesives; contact resistance stability; electromigration; electromigration resistance; high density interconnection assembly; lead-containing solders; reliability tests; silver filled ICAs; surface mount technology; Assembly; Conductive adhesives; Contact resistance; Electromigration; Independent component analysis; Lead; Silver; Stability; Surface-mount technology; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Polymers and Adhesives in Microelectronics and Photonics, 2001. First International IEEE Conference on

Conference_Location

Potsdam, Germany

Print_ISBN

0-7803-7220-4

Type

conf

DOI

10.1109/POLYTR.2001.973261

Filename

973261