Polymeric materials for adaptronic fibre modules

Author

Schaefer, Helmut ; Gesang, Thomas ; Hartwig, Andreas ; Knaebel, Harald ; Maurieschat, Uwe ; Riesenbeck, Thomas

Author_Institution

Fraunhofer-Institut fuer Fertigungstechnik und Angewandte Materialforschung, Bremen, Germany

fYear

2001

fDate

21-24 Oct. 2001

Firstpage

98

Lastpage

103

Abstract

The scientific field of "Adaptronics" combines sensor and actuator effects with electronics. The components furnished with adaptronics shall sense relevant properties and shall adapt in an intelligent way-they shall "feel, think and act". For instance, one application is the active vibration compensation of dynamically stressed structures. The scope of the work to be presented is to manufacture sensor/actuator microsystems with a low stiffness and thickness in order to sustain the favourable properties of the lightweight material used. In so doing, various adhesives and casting materials play an indispensable part in the manufacturing processes. The micro manufacturing of such systems is an activity of the Fraunhofer-Institute IFAM. The approach chosen includes the utilisation of piezo electric fibres in the diameter range from 20 /spl mu/m-200 /spl mu/m. The fibre modules consist of many fibres being contacted by interdigitated electrodes made of electrically conductive adhesives. In addition, structural adhesives and casting polymers are used.

Keywords

adhesives; casting; conducting polymers; elasticity; electrodes; encapsulation; fibre reinforced composites; microactuators; micromachining; microsensors; modules; piezoelectric materials; 20 to 200 micron; active vibration compensation; actuator effects; adaptronic fibre modules; adaptronics; adhesives; casting materials; casting polymers; dynamically stressed structures; electrically conductive adhesives; electronics; fibre diameter range; fibre modules; interdigitated electrodes; lightweight material; manufacturing processes; micro manufacturing; piezo electric fibres; polymeric materials; sensor effects; sensor/actuator microsystems; stiffness; structural adhesives; thickness; Actuators; Conductive adhesives; Electrodes; Intelligent sensors; Laminates; Manufacturing processes; Optical fiber polarization; Optical fiber sensors; Polymers; Sensor arrays;

fLanguage

English

Publisher

ieee

Conference_Titel

Polymers and Adhesives in Microelectronics and Photonics, 2001. First International IEEE Conference on

Conference_Location

Potsdam, Germany

Print_ISBN

0-7803-7220-4

Type

conf

DOI

10.1109/POLYTR.2001.973265

Filename

973265