Analysis of full-wave conductor system impedance over substrate using novel integration techniques

Author

Hu, Xin ; White, Jacob ; Lee, Jung Hoon ; Daniel, Luca

Author_Institution

M.I.T., Cambridge, MA, USA

fYear

2005

fDate

13-17 June 2005

Firstpage

147

Lastpage

152

Abstract

An efficient approach to full-wave impedance extraction is developed that accounts for substrate effects through the use of two-layer media Green´s functions in a mixed-potential-integral-equation (MPIE) solver. Particularly, the choice of implementation for the layered media Green´s functions motivates the development of accelerated techniques for both volume and surface integrations in the solver. Solver accuracy is validated against measurements taken on fabricated devices; solver efficiency is demonstrated by its 9.8× reduction in cost in comparison to the traditional integration approach.

Keywords

Green´s function methods; circuit CAD; circuit simulation; integral equations; integrated circuit design; mixed analogue-digital integrated circuits; multichip modules; system-on-chip; Green function methods; circuit CAD; circuit simulation; full-wave conductor system impedance; full-wave impedance extraction; integrated circuit design; mixed analogue-digital integrated circuits; mixed-potential-integral-equation solver; multichip modules; substrate effects; surface integration; system-on-chip; two-layer media Green functions; volume integration; Acceleration; Circuit noise; Circuit simulation; Conductors; Kernel; Nonhomogeneous media; Radio frequency; Semiconductor device noise; Substrates; Surface impedance;

fLanguage

English

Publisher

ieee

Conference_Titel

Design Automation Conference, 2005. Proceedings. 42nd

Print_ISBN

1-59593-058-2

Type

conf

DOI

10.1109/DAC.2005.193789

Filename

1510308