DocumentCode
2047686
Title
Research of a thermoelasticity of semiconducting microstructures
Author
Konstantin, Kolesnyk ; Roman, Panchak
Author_Institution
CAD/CAM Dept., Lviv Polytech. Nat. Univ., Lviv
fYear
2008
fDate
21-24 May 2008
Firstpage
94
Lastpage
94
Abstract
In paper the outcomes of research of a thermoelasticity of semiconducting structures MEMS represented. The analytical model for research of a thermoelasticity of microstructures designed.
Keywords
micromechanical devices; monolithic integrated circuits; thermoelasticity; MEMS; semiconducting microstructures; thermoelasticity; Finite element methods; Micromechanical devices; Microstructure; Power engineering and energy; Reliability engineering; Semiconductivity; Silicon; Temperature; Thermal stresses; Thermoelasticity; microelectromechanical system (MEMS); semiconducting microstructure; thermoelasticity;
fLanguage
English
Publisher
ieee
Conference_Titel
Perspective Technologies and Methods in MEMS Design, 2008. MEMSTECH 2008. International Conference on
Conference_Location
Polyana
Print_ISBN
978-966-2191-00-4
Type
conf
DOI
10.1109/MEMSTECH.2008.4558750
Filename
4558750
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