DocumentCode
2047913
Title
Smart label uses polymer thick film technology on low-cost substrates
Author
Luniak, Marco ; Monser, H.-P. ; Brod, V. ; Wolter, Klaus-Jurgen
Author_Institution
Electron. Technol. Lab., Dresden Univ. of Technol., Germany
fYear
2001
fDate
21-24 Oct. 2001
Firstpage
314
Lastpage
318
Abstract
A smart label represents a new generation of contactless electronic tags. It is a flexible device, which operates at a distance from a reader unit. That means that the IC chip on the smart label uses an RF antenna for its energy supply and the data transfer. The key markets of such devices are rental services, parcel services and above all logistics like airline baggage handling. This paper shows the process steps with emphasis on mass production, PET substrate reliability, low-cost paper substrates and our experiences in chip assembling with anisotropic conductive adhesive (ACA).
Keywords
adhesives; conducting polymers; identification technology; microstrip antennas; polymer films; thick film circuits; IC chip; PET substrate reliability; RF antenna; airline baggage handling; anisotropic conductive adhesive; chip assembling; contactless electronic tags; data transfer; flexible device; low-cost paper substrates; low-cost substrates; mass production; parcel services; polymer thick film technology; rental services; smart label; Assembly; Consumer electronics; Logistics; Mass production; Polymer films; Positron emission tomography; Radio frequency; Radiofrequency integrated circuits; Substrates; Thick films;
fLanguage
English
Publisher
ieee
Conference_Titel
Polymers and Adhesives in Microelectronics and Photonics, 2001. First International IEEE Conference on
Conference_Location
Potsdam, Germany
Print_ISBN
0-7803-7220-4
Type
conf
DOI
10.1109/POLYTR.2001.973301
Filename
973301
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