• DocumentCode
    2047913
  • Title

    Smart label uses polymer thick film technology on low-cost substrates

  • Author

    Luniak, Marco ; Monser, H.-P. ; Brod, V. ; Wolter, Klaus-Jurgen

  • Author_Institution
    Electron. Technol. Lab., Dresden Univ. of Technol., Germany
  • fYear
    2001
  • fDate
    21-24 Oct. 2001
  • Firstpage
    314
  • Lastpage
    318
  • Abstract
    A smart label represents a new generation of contactless electronic tags. It is a flexible device, which operates at a distance from a reader unit. That means that the IC chip on the smart label uses an RF antenna for its energy supply and the data transfer. The key markets of such devices are rental services, parcel services and above all logistics like airline baggage handling. This paper shows the process steps with emphasis on mass production, PET substrate reliability, low-cost paper substrates and our experiences in chip assembling with anisotropic conductive adhesive (ACA).
  • Keywords
    adhesives; conducting polymers; identification technology; microstrip antennas; polymer films; thick film circuits; IC chip; PET substrate reliability; RF antenna; airline baggage handling; anisotropic conductive adhesive; chip assembling; contactless electronic tags; data transfer; flexible device; low-cost paper substrates; low-cost substrates; mass production; parcel services; polymer thick film technology; rental services; smart label; Assembly; Consumer electronics; Logistics; Mass production; Polymer films; Positron emission tomography; Radio frequency; Radiofrequency integrated circuits; Substrates; Thick films;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Polymers and Adhesives in Microelectronics and Photonics, 2001. First International IEEE Conference on
  • Conference_Location
    Potsdam, Germany
  • Print_ISBN
    0-7803-7220-4
  • Type

    conf

  • DOI
    10.1109/POLYTR.2001.973301
  • Filename
    973301