DocumentCode :
2048066
Title :
Polymer optical interconnects for PCB
Author :
Schröder, Henning ; Bauer, Jörg ; Ebling, Frank ; Scheel, Wolfgang
Author_Institution :
Fraunhofer Inst. for Reliability & Microintegration, Berlin, Germany
fYear :
2001
fDate :
21-24 Oct. 2001
Firstpage :
337
Lastpage :
343
Abstract :
Fraunhofer IZM has developed a packaging concept, which is based on a hybrid carrier, containing both electrical and optical interconnects: the Electrical Optical Circuit Board (EOCB). The key element is an additional optical layer with multimode waveguide structures. This layer is handled by standard PCB technology. As a result, the waveguides are completely incorporated into the circuit board. We used the hot embossing process for the first test of effective foil-structuring. After filling the core of the waveguides and sealing them with an over-cladding, the optical layer is given into the PCB process. Furthermore, waveguide structuring by photolithographic patterning is also a promising way to incorporate waveguide structures into the circuit board and is currently under test. The choice of appropriate polymer materials is a key problem when applying these techniques. They have to be compatible with the structuring and laminating processes and display excellent optical properties. We focus on recent results showing the optical characteristics of laminated polymer waveguides made by hot embossing and of waveguides made by photolithography.
Keywords :
hot pressing; integrated optoelectronics; optical interconnections; optical polymers; optical waveguides; packaging; photolithography; printed circuit manufacture; EOCB; Fraunhofer IZM; PCB; additional optical layer; effective foil-structuring; electrical interconnects; electrical optical circuit board; hot embossing process; hybrid carrier; laminated polymer waveguides; multimode waveguide structures; optical properties; over-cladding; packaging concept; photolithographic patterning; polymer materials; polymer optical interconnects; waveguide structuring; Circuit testing; Displays; Embossing; Filling; Optical interconnections; Optical materials; Optical polymers; Optical waveguides; Packaging; Printed circuits;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Polymers and Adhesives in Microelectronics and Photonics, 2001. First International IEEE Conference on
Conference_Location :
Potsdam, Germany
Print_ISBN :
0-7803-7220-4
Type :
conf
DOI :
10.1109/POLYTR.2001.973306
Filename :
973306
Link To Document :
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