Title :
1997 Proceedings 47th Electronic Components and Technology Conference
Abstract :
The following topics were dealt with: optical serial links; plastic packaging; soldering; packaging education; parallel optical interconnects; low-cost flip chip; thermal mechanical modelling; single-chip packaging; VCSELs; optical connectors; MCMs; die attach; WDM; chip bonding; simulation; passive components; photonic device mounting; electrical modelling; and materials reliability
Keywords :
electronic engineering education; flip-chip devices; integrated circuit modelling; integrated circuit packaging; microassembling; multichip modules; optical fibre couplers; optical fibres; optical interconnections; optical links; plastic packaging; reliability; semiconductor lasers; simulation; soldering; surface emitting lasers; wavelength division multiplexing; MCMs; VCSELs; WDM; chip bonding; die attach; electrical modelling; low-cost flip chip; materials reliability; optical connectors; optical serial links; packaging education; parallel optical interconnects; passive components; photonic device mounting; plastic packaging; simulation; single-chip packaging; soldering; thermal mechanical modelling;
Conference_Titel :
Electronic Components and Technology Conference, 1997. Proceedings., 47th
Conference_Location :
San Jose, CA, USA
Print_ISBN :
0-7803-3857-X
DOI :
10.1109/ECTC.1997.606100
