• DocumentCode
    2049082
  • Title

    Novel fabrication method for oxide semiconductors via atomic-additive mediated crystallization

  • Author

    Itagaki, Naho

  • Author_Institution
    Grad. Sch. of Inf. Sci. & Electr. Eng., Kyushu Univ., Fukuoka, Japan
  • fYear
    2010
  • fDate
    21-24 Nov. 2010
  • Firstpage
    998
  • Lastpage
    1001
  • Abstract
    We report here a novel method of fabricating oxide semiconductors via a solid-phase crystallization from amorphous phase. By introducing a large amount of nitrogen atoms to the sputtering atmosphere, the amorphous phase is obtained, where the resultant films are amorphous oxynitride. Since the bonding energy is different between metal-oxygen and metal-nitrogen, solid-phase crystallization is achieved by annealing of amorphous oxynitride films in the oxidization atmosphere at adequate temperatures. The resultant oxide films are highly orientated even on quartz glass substrates and the crystallinity is higher than the films prepared by conventional sputtering deposition. The fabrication method proposed here is very promising for oxide films, especially for the oxide such as zinc oxide and indium (tin) oxide whose amorphous phase is difficult to be obtained.
  • Keywords
    II-VI semiconductors; amorphous semiconductors; annealing; crystal orientation; crystallisation; semiconductor growth; semiconductor thin films; sputter deposition; wide band gap semiconductors; zinc compounds; ZnO; ZnON; amorphous oxynitride films; annealing; atomic-additive mediated crystallization; bonding energy; crystallinity; metal-nitrogen crystallization; metal-oxygen crystallization; oxide semiconductors; oxidization; solid-phase crystallization; sputtering; light emitting diode; magnetron sputtering; solid-phase crystallization; transparent conductive oxide; zinc oxide;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    TENCON 2010 - 2010 IEEE Region 10 Conference
  • Conference_Location
    Fukuoka
  • ISSN
    pending
  • Print_ISBN
    978-1-4244-6889-8
  • Type

    conf

  • DOI
    10.1109/TENCON.2010.5686461
  • Filename
    5686461