Micro carrier for LSI chip used in the Hitachi M-800 processor group

Author

Inoue, Takashi ; Matsuyama, Haruhiko ; Matsuzaki, Eiji ; Narizuka, Yasunori ; Ishino, Masakazu ; Tanaka, Minoru ; Takenaka, Takaji

Author_Institution

Hitachi Ltd., Yokohama, Japan

fYear

1991

fDate

11-16 May 1991

Firstpage

704

Lastpage

711

Abstract

A compact chip carrier called the MCC (micro carrier for LSI chip) has been developed for high-density chip level packaging. The MCC realizes the smallest possible hermetic chip package by introducing full surface flip-chip interconnections, thin-film process technology, built-in termination resistors, and thermal expansion matched ceramic substrate. The MCCs are based on the mullite ceramic substrate and Al-polyimide thin-film circuits with built-in thin-film termination resistors. The main role of the MCC is to reliably interconnect the LSI I/Os and MLC I/Os by matching the I/O pad pitches of the LSI and those of the MLC. The authors discuss the structure of the MCC and the thin-film process technology for its fabrication

Keywords

flip-chip devices; large scale integration; microprocessor chips; packaging; thin film circuits; Al polymide thin film circuits; Hitachi M-800 processor group; I/O pad pitches; MCC; built-in termination resistors; chip carrier; full surface flip-chip interconnections; hermetic chip package; high-density chip level packaging; micro carrier; mullite ceramic substrate; thermal expansion matched ceramic substrate; thin-film process technology; Ceramics; Integrated circuit interconnections; Large scale integration; Packaging; Resistors; Substrates; Thermal expansion; Thermal resistance; Thin film circuits; Transistors;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1991. Proceedings., 41st

Conference_Location

Atlanta, GA

Print_ISBN

0-7803-0012-2

Type

conf

DOI

10.1109/ECTC.1991.163957

Filename

163957