• DocumentCode
    2049290
  • Title

    The fast initial threshold voltage shift: NBTI or high-field stress

  • Author

    Campbell, J.P. ; Cheung, K.P. ; Suehle, J.S. ; Oates, A.

  • Author_Institution
    Semicond. Electron. Div., NIST, Gaithersburg, MD
  • fYear
    2008
  • fDate
    April 27 2008-May 1 2008
  • Firstpage
    72
  • Lastpage
    78
  • Abstract
    Recent negative bias temperature instability (NBTI) studies have come to involve very high electric fields, yet these same studies are used to criticize the lower field ldquoNBTIrdquo models. This study examines both high- and low-field degradation phenomena by monitoring the initial threshold voltage shift (DeltaVTH) as a function of stress time and stress voltage. We demonstrate that the initial DeltaVTH is recoverable and decays rapidly as the stress voltage is reduced. We also monitor the transient transconductance (GM) degradation which surprisingly indicates the presence of an electron trapping/de-trapping component. We argue that the initial DeltaVTH and GM degradation behaviors are consistent with high-field stress degradation. The electron trapping component of the ldquorecoverablerdquo degradation is unexpected and must be addressed to insure accurate NBTI lifetime predictions.
  • Keywords
    MOSFET; electron traps; hole traps; electron trapping-detrapping component; fast initial threshold voltage shift; high-field stress degradation; negative bias temperature instability; stress time; stress voltage; transient transconductance degradation; Current measurement; Degradation; Electric variables measurement; Electron traps; Niobium compounds; Pollution measurement; Stress measurement; Threshold voltage; Time measurement; Titanium compounds; High-Field Stress; NBTI; electron-trapping; hole-trapping;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 2008. IRPS 2008. IEEE International
  • Conference_Location
    Phoenix, AZ
  • Print_ISBN
    978-1-4244-2049-0
  • Electronic_ISBN
    978-1-4244-2050-6
  • Type

    conf

  • DOI
    10.1109/RELPHY.2008.4558866
  • Filename
    4558866