A 36-chip multiprocessor multichip module made with the General Electric high density interconnect technology

A unique packaging and interconnect technology was used to build a multichip, four-CPU-element, pipeline parallel processing computer module using Texas Instruments TMS320C25 digital signal processors and companion circuits. The technology allowed a greater than fifteen-fold reduction in area over conventional chip packages mounted with printed circuit board methods. Reduced interconnect capacitance coupled with elimination of conventional package parasitics allowed clocking of commercial 40 MHz parts to nearly 90 MHz