• DocumentCode
    2050023
  • Title

    A multi-mode 3GPP-LTE/HSDPA turbo decoder

  • Author

    Ilnseher, Thomas ; May, Matthias ; Wehn, Norbert

  • Author_Institution
    Microelectron. Syst. Design Res. Group, Univ. of Kaiserslautern, Kaiserslautern, Germany
  • fYear
    2010
  • fDate
    17-19 Nov. 2010
  • Firstpage
    336
  • Lastpage
    340
  • Abstract
    The LTE standard supports a maximum throughput of 300MBit/s using 4×4 MIMO and a channel bandwidth of 20 MHz. At the same time the latest HSDPA technology supports 82MBit/s using 2×2 MIMO and Dual Cell techniques. While LTE uses a conflict-free interleaver, which allows highly efficient implementation of parallel decoders for such throughputs, HSDPA uses the UMTS interleaver that causes memory access conflicts. A combined turbo decoder is presented which supports both HSDPA and LTE with an overhead of only 11.5 % over an optimized LTE-only decoder. Its area is 1.46 mm2 in 40nm low power CMOS. Its power consumption is only 452 mW. State-of-the-art approaches utilizing design time conflict resolution require 9MB of storage for permutation tables. Our decoder achieves a reduction to 32kB by combining a hybrid technique with compression of the permutation vectors.
  • Keywords
    3G mobile communication; CMOS integrated circuits; Long Term Evolution; MIMO communication; code division multiple access; decoding; protocols; radio access networks; turbo codes; MIMO technique; UMTS interleaver; bandwidth 20 MHz; bit rate 300 Mbit/s; bit rate 82 Mbit/s; channel bandwidth; conflict-free interleaver; design time conflict resolution; dual-cell techniques; low-power CMOS technology; memory access conflicts; multimode 3GPP-LTE-HSDPA turbo decoder; parallel decoders; permutation vector compression; power 452 mW; size 40 nm; Clocks; Computer architecture; Decoding; Multiaccess communication; Random access memory; Spread spectrum communication; Throughput;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Communication Systems (ICCS), 2010 IEEE International Conference on
  • Conference_Location
    Singapor
  • Print_ISBN
    978-1-4244-7004-4
  • Type

    conf

  • DOI
    10.1109/ICCS.2010.5686499
  • Filename
    5686499