Title :
Carbon nanotubes as interconnects: Emerging technology and potential reliability issues
Author :
Thompson, Carl V.
Author_Institution :
Dept. of Mater. Sci. & Eng., MIT, Cambridge, MA
fDate :
April 27 2008-May 1 2008
Abstract :
The use of carbon nanotubes (CNTs) to replace or complement Cu-based IC interconnects is under wide-spread investigation. CNTs have low resistivities and can be configured to have low capacitive coupling, and are also chemically stable so that diffusion barriers are not needed. They can also carry very high current densities without damage. Properties and processing of CNTs for IC interconnects are reviewed and emerging technologies and possible reliability issues are discussed.
Keywords :
carbon nanotubes; current density; integrated circuit interconnections; C; IC interconnects; capacitive coupling; carbon nanotubes; current density; Carbon nanotubes; Chemical technology; Conductivity; Current density; Electrons; Integrated circuit interconnections; Integrated circuit reliability; Integrated circuit technology; Materials science and technology; Wiring;
Conference_Titel :
Reliability Physics Symposium, 2008. IRPS 2008. IEEE International
Conference_Location :
Phoenix, AZ
Print_ISBN :
978-1-4244-2049-0
Electronic_ISBN :
978-1-4244-2050-6
DOI :
10.1109/RELPHY.2008.4558914
